Submitted by admin on Fri, 06/11/2010 - 16:13
Image:
Trays can be continuously heated or batched into a single thermal environment. Through-the-wall connections provide power, clock, control and monitoring via driver circuits for each tray, situated outside the BI environment. MultiZone is ideal for high volume Burn-In of complex devices in a production environment. Available with either PC control or manual stand-alone visual display per tray.
Brochure:
Key Applications:
Electronic components
Tray Capacity:
20
Carrier Capacity:
N/A
Component Testing:
Yes
Sub-assembly testing:
Yes
Temp - max:
+150
Temp - min:
+50
Static Testing:
Yes
Dynamic Testing:
Yes
Monitored Testing:
Yes
Thermal Zones:
1
Clock Drive Zones:
20
Power Supply Zones:
1-20 Weight:
3